Dr. Douglas H. Morais received a PhD from the University of Ottawa, Ontario, Canada, an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. He is a graduate of theAEA/Stanford Executive Institute, Stanford University, California. After decades in industry he is currently an, author and short course lecturer.. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of ＂Fixed Broadband Wireless Communications,＂ Pearson Education, Inc., 2004 and ＂Key 5G Physical Layer Technologies,＂ Springer Nature Switzerland AG, 2020. He holds three US patents, including ＂Hard and Soft Bit Demapping for QAM Non-Square Constellations＂, ＂Quadrature Amplitude Modulation via Modified-Square Signal Point Constellation,＂ and ＂Radio Communication System Using Frequency Division Multiplexing for Transmission Between a Master Station and a Plurality of Remote Stations,＂. He is a Life Senior Member of the IEEE, and a member of the IEEE Communications Society.